This product is polysiloxane that takes silicon oxygen bond as main chain. Upon curing crosslinking, it becomes resilient cross linked resin. It is a new type of heat resisting insulating material with excellent performance. This resin shows outstanding performance in high temperature resistance and electric insulation. It also has multiple other performance such as moisture resistance, inflaming retarding, and anti-corrosion. Its main performance is up to the advanced level of China. So far the product has come into wide use in such industries as space navigation, household appliance, electronics, electric motor, chemical engineering, modified oxidized metal, mica insulator, etc.

resistance to high temperature, electrical insulation, moisture protection, and watertightness. It is an ideal binding material for manufacturing high-temperature mica plate and glass fiber laminated pressing plate. It can also be used as the wear resistant and polishing treating agent for marble and floor tiles. This product is relatively hard and brittle, and is high in curing degree. Moreover, there is little volatile matter during curing.

This product is a type of resin with highly crosslinked structure. After curing, it has high hardness and can easily integrate with inorganic substance. It shows high heat resistance. When the temperature reaches glass transition temperature (800℃), there are more residues which are bonded through Si-O key and Si-C key. Therefore, it still shows higher cohesiveness in high temperatures.

This product shows excellent performance in high temperature resistance, electrical insulation, and moisture protection. It is applicable to H type motor, transformer coil, transistor sealing, and the dipping of H-level glass fiber electric wire as well as high-temperature resistant coating, etc.

It has high heat resistance, flexibility and good insulation moisture resistance. It is suitable for motor coil wrapping, soft glass enamel cloth, soft mica tape, soft mica board, glass wire casing coating, heat resistant and high temperature resistant coating and transistor sealing protective adhesive.